A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

For global organizations, HR managers must design compensation and benefits packages that are both competitive and compliant across multiple international jurisdictions. With varying labor laws, tax ...

If you’re a business leader who is desperately trying to keep your business, department, or team staffed, it may be time to review your benefits package. The Fast Company Executive Board is a private, ...