Wafers produced for products as diverse as LEDs and MP3 players vary greatly in function, but they have one thing in common: They often undergo optical inspection after they pass an electrical test.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Inspecting punches and dies can be time-consuming and costly for tablet manufacturers. Advances in technology, however, have greatly improved in-process inspections. The author examines improvements ...