The gap between lab measurements and real-world applications can lead to suboptimal socket selection and hidden quality risks ...

Time-Consuming Setup and Reconfiguration: Establishing a scan path to reach an instrument deep within the hierarchical ...

Now, the biggest change involves incorporating AI tools to speed analysis and catch anomalies or outliers that humans could ...

The convergence of AI, analytics, and data sharing represents the most significant operational evolution since the foundry ...

Some chipmakers aim to outgun the competition with sheer performance. Flagship GPUs, for example, focus on FLOPS and huge ...

ACS RTDI not only facilitates secure operations but also unlocks advanced capabilities such as adaptive test, data ...

Bump technologies are being pushed beyond what was thought to be their physical and performance limits.

That is the role of In‑Field Test. By enabling ATE‑like structural and scan testing in deployed systems, it extends the reach ...

Manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip ...

When a good die fails test and gets scrapped, often no one notices, because false failures look identical to real ones. Yet across the industry, these phantom defects are quietly eroding yield, ...

At the edge Models are built on the cloud and applied at the edge. Moving data from inspection/metrology systems to the cloud to make a decision to execute back at the system is simply impractical.

Chiplets offer unprecedented flexibility in high-performance designs, but they also add new challenges on the verification ...