Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges ...

Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration.

Increasing complexity requires thermal, electrical, and mechanical effects to be analyzed together. Complex designs now ...

Plus, agentic EDA and AI-generated analog layout, small chip fabs, diamond-based defect inspection, large-area nanoimprint ...

Champaign, National Energy Technology Laboratory, Argonne National Laboratory, and Monash University published a technical ...

Siemens’ Sriram Bhaskar Teja Mundru shows how UALink over UCIe 3.0 improves cross-vendor interoperability and enables the ...

Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the ...

Closing the visibility gap looks different as a result. The goal isn’t one test, model, sensor, or inspection system that somehow sees everything. It’s getting better at recognizing what each view can ...

The semiconductor industry is undergoing a transformation. This transformation is driven by the critical role semiconductors play in decarbonization and digitalization and their ability to enable ...

Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

Researchers at Carl Zeiss SMT and ASML published a technical paper titled “Hyper-NA: a system with a numerical aperture of at least 0.75.” Abstract Summary: The researchers examine Hyper-NA EUV ...