Micron Hiroshima fab expansion adds Japan-backed HBM capacity for AI chips, with new production equipment due in late 2028.

STMicroelectronics says edge AI imaging is shifting from camera sensors to perception platforms using FlightSense and BrightSense.

Keysight introduces RF signal analyzers for faster wireless design and validation with wider bandwidth and more accurate RF ...

Share your thoughts about PCB design. What type of PCBs do you design most often? What typically influences your decisions?

Infineon completes OSRAM acquisition, expanding its sensor portfolio for automotive, industrial and medical edge applications ...

Discover SDR with HackRF One & HackRF Pro. Learn GNU Radio, digital signal processing, receiver design, and RF ...

Palantir NVIDIA AI brings Nemotron open models into secure US government and critical infrastructure deployments with ...

Rocket Lab Iridium deal brings launch, satellites, L-band spectrum and 2.55 million subscribers into one space services group ...

KAYTUS introduces KSManage Ultra, an AI infrastructure management platform for unified monitoring, automation, and AI data ...

CoreWeave and Conapto expand AI infrastructure in Sweden with renewable-powered data centres to boost European AI cloud ...

The megawatt power demands of AI data centres mean the rollout is being slowed by connections to local electricity grids ...

Toshiba launches an 80 V AI power MOSFET for data center power supplies, delivering lower power loss, improved cooling, and ...